光刻缺陷检查培训英文版(ppt 47页)

主要内容
Visual Defect Introduction
Layer Code
AC：Arcing
BC / BV：Blind Contact / Blind VIA
BR ：bridge
C1：Tape residue
C2 ：Foreign contamination
CR ：corrosion
CK：Crack
C3：Si fragment
CO：contamination
DC：Dis-color
DM：Damaged （silicon damage）
HL：Hillock
HZ：Nitride haze
LD：local defocus
MA：mis-alignment
NU：Non-uniform
OE：over etch
PA：particle 
PB：PR burn
PI：Pits
PM：polymer
PC：Poor coating
PL：PR lifting
PR：PR remaining
PW：Powder
RE：Residue (ETCH)
RP：Residue (PHOTO)
RD：repeating defect
RF：roughness
SC：scratch
SN：Si precipitate
SP：Si Precipitate
UD：under develop
WS：water spot
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